In Situ Thin-Film Stress, Strain and Wafer Curvature

Curvature and Stress Measurement System on MBE Chamber

kSA MOS

In situ tool for measuring real-time film stress, film strain, and wafer curvature induced by thin films or thermal processes on a substrate/wafer.

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ICE Head on MOCVD Reactor

kSA ICE

MOS Module: In situ modular tool for measuring real-time film stress, film strain and wafer curvature induced by thin films or thermal processes on a substrate/wafer, ideal for MOCVD reactors with high speed or low speed rotation and limited optical access.

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Ex Situ Thin-film Stress, Strain, Wafer Curvature, Bow, and Tilt

Wafer Curvature and Bow Measurement System

kSA MOS UltraScan/ ThermalScan

Ex situ tool with full 2D wafer mapping, for measuring film stress, film strain, and wafer curvature, bow, and tilt induced by thin films or thermal processes on a substrate/wafer.

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Thin Film and Industrial Metrology Systems

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