k-Space representative, Jung Woo Corporation, will provide hands-on demonstration of the kSA MOS ThermalScan and other k-Space compound semiconductor metrology tools at the Advanced Semiconductor Packaging Show in South Korea.
The kSA MOS ThermalScan provides quantitative film stress analysis with full area spatial map by first scanning the bare substrate and then re-scanning the wafer post-process. Unmatched wafer curvature, stress, and bow analysis capabilities are at your fingertips for obtaining large sample uniformity profiles and/or localized isolation of sub-millimeter areas of interest with very high spatial resolution.
